I don't think anything in the emails was market sensative.He...

I don't think anything in the emails was market sensative.

1. He stated they are still negotiating on price. Honestly price is the main factor in any negotiation, so it goes without saying he is negotiating on price in the negotiations which he has mentioned many many times.
2. The extra equipment needed by a fab is no surprise at all, public records for foundries state that utilisation is well above 80%, its normal to have some delay in the industry, even 6 months for existing products which don't need new technology: https://www.mobilityoutlook.com/features/22nm-plus-chip-fabs-ideal-for-auto-industry-says-iesa/

A side note... really need to get GF & UMC signed up.

• TSMC will be amazing, but a challenge considering their own reram...
• Samsung put their eggs into MRAM after years of their own RERAM research so unlikely to buy someone elses I think.
• SMIC, NexChip & Huahong are chinese, so need to be careful of laws & technology theft...
• Hua Hong & VIS don't have small nodes 90nm + i think, so out of the question that they would pay top dollar
• Tower also stops at 45nm, so don't urgently need reram to replace flash
• 73 new semiconductor fabs being built around the world, 16 of which will be 10nm or below.... hopefully Coby is talking to the startups ( too.
• And of course the IDMs, I think thats where coby will try to sign 2 deals this year.